wiring/PU_Connection-Schedule_Rev-A.md

1# PoppyUp — connection schedule (Rev A, 2026-09-27, DRAFT — FOR REVIEW)2 3Generated from `wiring/model.py`. Off-board connections first (cables, flexes, mated modules, bonds), then on-board power links.4 5| ID | From | To | Medium | Signal / service | Class | Length | Status | Source | Sheets |6|---|---|---|---|---|---|---|---|---|---|7| W-01 | Main board J3 | Reader daughterboard J6 | Direct mate, Samtec ADM6/ADF6 80-pin, stack 5–8 mm | CFe B Gen3/Gen4 ×2 + REFCLK + sidebands; CFe A ×1; 3× Gen3 ×1 (GL9755/GL9750/ASM1064) + REFCLKs + PERST#; 3.3 V slots (8 pins) / 3.3 V logic (2) / 1.8 V (1); 5× PWR_EN; SLOT_FAULT#; SLOT_DET[4:0]; HALL; LED_DATA; I²C; NTC_CFEB; RB_PRESENT#; GND | HS | 0 (mated) | Verified | 09 §8.1 | PU-W-101 PU-W-201 |8| W-02 | Battery pack PCB J1 | Main board J12 | 6-way discrete-wire pack harness with locking connector | PACK+, PACK−, SMBus CLK, SMBus DAT, NTC, PRES# | POWER | TBD (~60 mm est.) | Verified | 05 §2.5, 09 §9.1 | PU-W-101 PU-W-202 PU-W-204 |9| W-03 | 2.42" 128 × 64 OLED module, SSD1309, SPI FPC | Main board J10 | Module-supplied 30-pin 0.5 mm FPC | OLED_SPI (SCLK, SDIN), OLED_CS, OLED_DC, OLED_RST, VDD 3.3 V, VCC 12 V (boost, on MB or in module — 05 §5), GND | BUS | module tail | Verified | 02 §8, 09 §9.1, 05 §5 | PU-W-101 PU-W-204 |10| W-04 | Button flex (power/action button, ring light pipe) FPC | Main board J11 | 6-pin 0.5 mm FPC (front-frame flex) | BTN, button ring LED (if on flex), HALL (only if the Hall sensor is on the flex — conflict, see notes), 3.3 V AON, GND | CTRL | TBD | Assumed | 09 §9.1 (J11 'Button/Hall flex'), 09 §1 (Hall on RB), 09 §8.1 pin 66 | PU-W-101 PU-W-204 |11| W-05 | M.2 Key-E 2230 Wi-Fi 7 module (MediaTek MT7925) ANT0 | Wi-Fi antenna WIFI0, tri-band flex element PIG | MHF4 (I-PEX 20449) 1.37 mm coax | Wi-Fi chain 0, 2.4 / 5 / 6 GHz | RF | 140–150 mm (est.) | Verified | 07 §4.3 | PU-W-101 PU-W-203 |12| W-06 | M.2 Key-E 2230 Wi-Fi 7 module (MediaTek MT7925) ANT1 | Wi-Fi antenna WIFI1, tri-band flex element PIG | MHF4 (I-PEX 20449) 1.37 mm coax | Wi-Fi chain 1, 2.4 / 5 / 6 GHz | RF | ≈ 60 mm (est.) | Verified | 07 §4.3 | PU-W-101 PU-W-203 |13| W-07 | Reader daughterboard J7 | 5-segment RGB LED bar — | On-board LEDs (baseline) or 4-pin FPC to light-guide flex (alternative) | LED_DATA (serial addressable), 3.3 V AON or 5 V (TBD, 05 §5 LDO note), GND | CTRL | — | TBD | 09 §9.2 J7, 09 §1, 05 §5 | PU-W-101 PU-W-204 |14| W-08 | Mechanical thermal switch (hardware backstop) LEADS | Main board TP-THSW | 2 discrete leads, termination TBD | THERM_ALERT to EC; contact in series with a circuit TBD (charge path / pack region, 06 §12 item 10) | CTRL | TBD | TBD | 00 §3.5, 02 §8, 06 §7.2/§12 | PU-W-101 PU-W-103 |15| W-09 | Main board J17 | Tunnel fan (reserved envelope, not fitted) — | Reserved 3-pin 1.25 mm header, unpopulated | Fan supply (rail TBD), GND, TACH/PWM (TBD) | REF | — | TBD | 09 §9.1, ADR D5 | PU-W-101 PU-W-204 |16| W-10 | RK3588(J) SoM (Firefly Core-3588J default; Forlinx / board-down at PoC exit, D12) — | Main board J1 | Direct mate, SoM B2B connector set + 2× M2 retention screws | pcie3x4 (Gen3 ×2 used), pcie3x2 (Gen3 ×2), pcie2x1l0/l1/l2, USB3 OTG0/OTG1, USB2 host ×2, SPI (TPM), UART/I²C/GPIO to EC, 5.0 V SYS in, GND | MECH | — | Verified | 02 §3, 09 §9.1, §11 | PU-W-101 |17| W-11 | M.2 Key-E 2230 Wi-Fi 7 module (MediaTek MT7925) — | Main board J8 | Direct mate, M.2 Key-E socket + chassis-pressed standoff | PCIe Gen2 ×1 (pcie2x1l1) + REFCLK + PERST#/CLKREQ#/W_DISABLE#, USB 2.0 (BT, held in reset), 3.3 V LOGIC via LC π filter, GND | MECH | — | Verified | 02 §4.4, 05 §5, 09 §11 | PU-W-101 PU-W-203 |18| W-12 | M.2 M-key 2280 NVMe SSD (Pro SKU; socket empty on Base) — | Main board J9 | Direct mate, M.2 M-key socket + chassis-pressed standoff (Pro) | PCIe Gen3 ×2 from ASM2812 + REFCLK + PERST#/CLKREQ#, 3.3 V via 2.5 A eFuse from 3.3 V SLOTS (or separate 3 A buck — EVT decision), GND | MECH | — | Verified | 02 §4.3, 05 §3.2/§4, 09 §11 | PU-W-101 PU-W-203 |19| W-13 | Main board J4 | Host / PD source on Port A (iPhone, Mac, PC, charger) — | User cable, USB-C | USB 3.2 Gen1 device (RK3588 OTG1) + USB 2.0; PD sink 5–20 V ≤ 100 W accepted (input limit 3.3 A at 20 V); PD source 5 V/1.5 A (PR_Swap option) | HS | — | Verified | 00 §3.3/3.4, 05 §7 | PU-W-101 PU-W-203 |20| W-14 | Main board J5 | External SSD / tethered phone / USB cellular adapter on Port B — | User cable, USB-C | USB 3.2 Gen2 host (ASM3142) + USB 2.0; 5 V source 0.5 / 1.5 / 3 A (Rp set by EC; 3 A only with external PD present, D13) | HS | — | Verified | 00 §3.3/3.4, 05 §7.4 | PU-W-101 PU-W-203 |21| W-15 | Main board J6 | USB4 host / PD source on Port C (Pro SKU) — | User cable, USB-C (USB4 40 Gb/s rated) | USB4 device (ASM2464PD, USB 3.2 Gen2 UAS fallback) — Pro only; PD sink 5–20 V ≤ 3.25 A via priority mux — Pro only; Base: receptacle blanked, VBUS to attach-detect only | HS | — | Verified | 00 §3.4, 05 §7.5 | PU-W-101 PU-W-203 |22| W-16 | Main board J7 | 5GBASE-T network — | Cat 6A patch cable | 5GBASE-T, 4 MDI pairs through discrete magnetics; hinged door (IP54 closed) | HS | — | Verified | 00 §5, 09 §3.5, 08 §7 | PU-W-101 PU-W-203 |23| W-17 | Main board GND | Magnesium AZ91D chassis (ground reference) — | 8× screw bosses on exposed L1 GND rings (6 vias each); masked bare conversion-coated Mg; Zn-Ni steel or Al screws | Chassis ground bond | BOND | — | Verified | 09 §6, 08 §4.1 | PU-W-101 |24| W-18 | Reader daughterboard GND | Magnesium AZ91D chassis (ground reference) — | RB mounting rail + 5 cage pins | Chassis ground bond; shutter and connector cages grounded to RB GND | BOND | — | Verified | 09 §6, 08 §12 step 5 | PU-W-101 |25| W-19 | Main board J4/J5/J6/J7 shells | Magnesium AZ91D chassis (ground reference) — | Receptacle brackets (Zn-Ni steel / Al) and RJ45 frame riveted to chassis wall | Single-point-per-connector chassis bond; shells also to board GND at the connector | BOND | — | Verified | 09 §6, 08 §7 | PU-W-101 PU-W-203 |26| W-20 | Battery pack PCB PACK− | Main board GND | One-point bond near the charger | Battery negative reference | BOND | — | Verified | 09 §6 | PU-W-101 PU-W-202 |27| W-21 | Wi-Fi antenna WIFI0, tri-band flex element shield | Magnesium AZ91D chassis (ground reference) — | Coax shield to chassis at the element end (feed PCB / EMI strip), within 10 mm of the element | RF ground | BOND | — | Verified | 07 §4.3 | PU-W-203 |28 29## Notes per connection30 31- **W-01** — Logical allocation only; physical pin assignment finalised from connector S-parameters at layout (09 §8.1). Stack height set when 08 fixes RB-to-MB spacing (09 §13).32- **W-02** — Signal list from 05 §2.5. Connector family unresolved (see MB J12). Pack path rating: 10 A continuous / 20 A fuse (09 §2.3) vs 10 A chemical fuse, BQ40Z50 OCD 15 A (05 §2.5, §12) — reconcile. Battery negative bonded to MB GND at one point near the charger (09 §6).33- **W-03** — Pin numbers per the selected SSD1309 module datasheet — TBD. Connected at frame-marry step (08 §12 step 7).34- **W-04** — Hall sensor is listed both on RB (mezzanine pin 66 HALL) and on the J11 flex. Baseline drawn: Hall on RB; J11 carries button + ring LED. Pin allocation is a proposal.35- **W-05** — ≈ 140–150 mm along the chassis top rail; ≤ 0.35 dB at 6 GHz. Clipped every 30 mm; ≥ 10 mm from buck inductors; shield grounded to chassis within 10 mm of the element. ~30 mating cycles.36- **W-06** — ≈ 60 mm; ≤ 0.15 dB at 6 GHz. Same routing rules as W-05.37- **W-07** — Decide at industrial design. LED_DATA reaches RB over mezzanine pin 67. LED-bar supply: 3.3 V AON if peak ≤ 100 mA, else an LED driver from 5 V SYS (05 §5).38- **W-08** — Rating conflict: 48 °C (02 §8, 06 §7.2, 09 §7) vs '60 °C class, re-rated from 48 °C' (ADR 00 §3.5). Location and interrupted circuit fixed at EVT schematic release.39- **W-09** — Fan decision at the EVT-exit gate.40- **W-10** — J1/J2 do not exist if PoC exit selects board-down RK3588J (D12).41- **W-12** — Socket present on Base, module absent.42- **W-17** — Never stainless into Mg (D4). Contact resistance after 500 h salt fog — verify at EVT.43- **W-21** — Same for WIFI1.44 45## On-board power links (PU-W-102)46 47| ID | From | To | Rail | Current | Status | Source | Notes |48|---|---|---|---|---|---|---|---|49| P-01 | J4 Port A VBUS | TPS25750-A (CC/PD) and VBUS priority mux input A (Pro) / 0 Ω bypass (Base) | VBUS 5–20 V | ≤ 3.25 A used (100 W tolerated) | Verified | 05 §7.1, 09 §5.1 | TVS 24 V + OVP 22 V at the receptacle |50| P-02 | J6 Port C VBUS | TPS2121-class priority mux input B (Pro only) | VBUS 5–20 V | ≤ 3.25 A (verify mux at 20 V / 65 W) | Verified | 05 §7.5, 09 §5.1 | Base: VBUS pin to attach-detect divider + TVS only |51| P-03 | VBUS priority mux output | BQ25792 VBUS input | VBUS_IN 5–20 V | ≤ 3.25 A | Verified | 09 §5.1 | 2× 22 µF + TVS at mux output; break-before-make gap ridden by charger input capacitance |52| P-04 | J12 PACK+ / PACK− | BQ25792 BAT | VBAT 5.6–8.4 V (2S) | 5 A charge; system path 7 A; pack fuse 10 A | Verified | 05 §2.5, §5, §8 | Trace sized for 2× fuse rating to the fuse (05 §12) |53| P-05 | BQ25792 VSYS | 5.0 V SYS buck (TPS56637, 6 A) | VSYS 6–8.4 V | ≤ 3.1 A out | Verified | 05 §3.2, §5 | Bulk on VSYS: 2× 470 µF polymer + 4× 22 µF (05 §10.2) vs 2× 220 µF + 10× 10 µF (09 §5.1) — reconcile |54| P-06 | BQ25792 VSYS | 5.0 V PORT B buck (TPS62933, 3 A) | VSYS | ≤ 3 A out | Verified | 05 §3.3, §5 | EN from EC; enabled only on Port B attach |55| P-07 | BQ25792 VSYS | 3.3 V SLOTS buck (LMR33640, 4 A) | VSYS | ≤ 3.85 A out (6 A class on Pro if NVMe fed from it) | Verified | 05 §3.2, §5 |  |56| P-08 | BQ25792 VSYS | 3.3 V LOGIC buck (LMR33640, 4 A) | VSYS | ≤ 3.1 A out (Pro peak) | Verified | 05 §3.2, §5 | LC π filter at M.2 Key-E (< 20 mVpp) |57| P-09 | VBAT (05 §4) / VSYS (09 §5.1) — conflict | 3.3 V AON LDO (TPS7A16, 100–150 mA) | VBAT or VSYS | ≤ 120 mA | Verified | 05 §4, §5, 09 §5.1 | 05 feeds the AON LDO from VBAT (pack); 09 feeds it from VSYS. Drawn from VBAT (keeps EC alive with charger in ship mode); reconcile at schematic |58| P-10 | 3.3 V AON | nRF5340 EC, Hall, RTC, SMBus pull-ups, LED bar (if ≤ 100 mA) | 3.3 V AON | ≤ 120 mA | Verified | 05 §3.2, §11 | Coin cell MS621 (3 mAh) backs the RTC |59| P-11 | 5.0 V SYS | SoM VIN via J1/J2 | 5.0 V ±3 % | ≤ 1.6 A (8 W peak) | Verified | 05 §3.2 | SoM's RK806 PMIC generates its own rails |60| P-12 | 5.0 V SYS | Port A source eFuse 1.5 A → J4 VBUS (source role, PR_Swap phone top-up) | 5.0 V | 1.5 A | Verified | 05 §4, §7.2 |  |61| P-13 | 5.0 V SYS | OLED VCC boost 12 V (TPS61041 class, or in module) → J10 | 12 V | ~30 mA | Verified | 05 §4, §5 |  |62| P-14 | 5.0 V PORT B | TPS2596 eFuse (3.3 A trip, EC ILIM 0.5/1.5/3 A) → J5 VBUS | 5.0 V | 0.5 / 1.5 / 3 A | Verified | 05 §7.4 | Reverse-current blocking; VBUS applied only after Rp is set |63| P-15 | 3.3 V SLOTS | J3 mezzanine pins 44–51 (8 pins) → RB slot eFuses | 3.3 V | ≥ 6 A total, 0.75 A/pin derated | Verified | 09 §8.1 |  |64| P-16 | 3.3 V SLOTS | eFuse 2.5 A (Pro) → J9 M.2 NVMe 3.3 V | 3.3 V | ≤ 1.8 A | Verified | 05 §3.2, §4 | Alternative: separate 3 A buck — EVT decision |65| P-17 | RB 3.3 V slots (post-mezzanine) | 5× eFuse TPS2596 class → slots J1–J5 | 3.3 V | CFe B 2.5 / CFe A 1.5 / CFast 1.0 / SD 0.8 / µSD 0.5 A (09 §5.2) vs 2.0 / 1.2 / 1.2 / 0.5 / 0.3 A (05 §3.2, §4) — conflict | Verified | 09 §5.2, 05 §3.2 | EN = PWR_EN from EC AND card-detect; soft-start 1–2 ms; active discharge on CFe B; fault wired-OR to SLOT_FAULT# |66| P-18 | 3.3 V LOGIC | ASM2812 I/O + 1.05 V local buck (TPS62823) | 3.3 V / 1.05 V | ~1 A core | Verified | 05 §4, 09 §5.1 | Point-of-load buck ≤ 15 mm from the chip |67| P-19 | 3.3 V LOGIC | RTL8126 I/O + 1.05 V local buck | 3.3 V / 1.05 V | ≤ 1.5 A core | Verified | 05 §4, 09 §5.1 |  |68| P-20 | 3.3 V LOGIC | ASM3142 + 1.05 V local buck | 3.3 V / 1.05 V | — | Verified | 05 §4, 09 §5.1 |  |69| P-21 | 3.3 V LOGIC | Load switch (ASM2464_PWR_EN from EC) → ASM2464PD + 1.05 V local buck + SPI flash (Pro) | 3.3 V / 1.05 V | ~1.2 A core | Verified | 05 §7.5, 09 §5.1, 02 §6.1 | Bridge unpowered in standalone mode (zero draw) |70| P-22 | 3.3 V LOGIC | J8 M.2 Key-E (MT7925) via LC π filter | 3.3 V | ≤ 0.75 A (2.5 W pk) | Verified | 05 §5 |  |71| P-23 | 3.3 V LOGIC | PI3DBS16412 lane mux, HCSL clock mux, 74LVC1G373 latch, TPM SLB9672 (1.8 V I/O per 09 §5.1), PD controllers ×3 | 3.3 V | small | Verified | 05 §4, 09 §5.1, §5.4 |  |72| P-24 | 3.3 V LOGIC | J3 mezzanine pins 52–53 → RB GL9755 / GL9750 / ASM1064 (+ RB 1.2 V ASM1064 core) | 3.3 V | ~0.4 A | Verified | 09 §8.1, §2.2 |  |73| P-25 | 1.8 V buck (1 A) on MB, fed from 3.3 V LOGIC (05 §3.2) | UHS-II I/O (via mezzanine pin 54), TPM, misc I/O | 1.8 V | 0.6 A | Verified | 09 §5.1, §8.1 | 05 §5 lists a TLV75518 LDO for the readers' 1.8 V — one 1.8 V source, two documents; reconcile |74 75## Mezzanine J3/J6 allocation (PU-W-201, from docs/09 §8.1)76 77| Pins | Group | n | Main-board side | Reader-board side | Notes |78|---|---|---|---|---|---|79| 1–8 | CFe B PCIe lane 0/1 TX/RX (4 pairs) | 8 | PI3DBS16412 common port (Gen4-capable) | J1 CFe B slot, L3 straight run ≤ 40 mm | GND interleaved per Samtec ground pattern |80| 9–10 | CFe B REFCLK+/− | 2 | HCSL 2:1 clock mux output | J1 CFe B REFCLK | 100 Ω HCSL |81| 11–13 | CFe B PERST#, CLKREQ#, WAKE# | 3 | EC GPIO (PERST# out; CLKREQ#/WAKE# in) | J1 CFe B sideband | EC forwards to SoC or ASM2464PD by mode |82| 14–17 | CFe A PCIe lane 0 TX/RX (2 pairs) | 4 | ASM2812 downstream port (Gen3 ×1) | J2 CFe A slot |  |83| 18–19 | CFe A REFCLK | 2 | ASM2812 downstream REFCLK | J2 CFe A |  |84| 20–22 | CFe A PERST#, CLKREQ#, WAKE# | 3 | ASM2812 downstream / EC GPIO (owner TBD at schematic) | J2 CFe A sideband |  |85| 23–26 | GL9755 lane (2 pairs) | 4 | ASM2812 downstream (Gen3 ×1) | GL9755 (SD UHS-II host) |  |86| 27–28 | GL9755 REFCLK | 2 | ASM2812 | GL9755 |  |87| 29 | GL9755 PERST# | 1 | ASM2812 / EC (TBD) | GL9755 |  |88| 30–33 | GL9750 lane (2 pairs) | 4 | ASM2812 downstream (Gen3 ×1) | GL9750 (microSD host) |  |89| 34–35 | GL9750 REFCLK | 2 | ASM2812 | GL9750 |  |90| 36 | GL9750 PERST# | 1 | ASM2812 / EC (TBD) | GL9750 |  |91| 37–40 | ASM1064 lane (2 pairs) | 4 | ASM2812 downstream (Gen3 ×1) | ASM1064 (AHCI SATA → CFast) |  |92| 41–42 | ASM1064 REFCLK | 2 | ASM2812 | ASM1064 |  |93| 43 | ASM1064 PERST# | 1 | ASM2812 / EC (TBD) | ASM1064 |  |94| 44–51 | 3.3 V SLOTS | 8 | 3.3 V SLOTS buck output | 5× slot eFuse inputs | ≥ 6 A total, 0.75 A/pin derated |95| 52–53 | 3.3 V LOGIC | 2 | 3.3 V LOGIC buck | GL9755 / GL9750 / ASM1064 |  |96| 54 | 1.8 V | 1 | 1.8 V buck | UHS-II I/O |  |97| 55–59 | CFEB / CFEA / SD / USD / CFAST_PWR_EN | 5 | EC GPIO out | eFuse EN (AND card-detect) |  |98| 60 | SLOT_FAULT# | 1 | EC GPIO in | wired-OR of 5 eFuse FLT# |  |99| 61–65 | SLOT_DET[4:0] | 5 | EC GPIO in (interrupt, wake) | card-detect switches |  |100| 66 | HALL | 1 | EC GPIO in | Hall sensor (shutter closed) | see J11 conflict |101| 67 | LED_DATA | 1 | EC serial-LED out | J7 LED bar |  |102| 68–69 | I²C SDA / SCL | 2 | EC I²C | RB EEPROM (board ID / variant), eFuse telemetry |  |103| 70 | NTC_CFEB | 1 | EC ADC | NTC at CFe B cage | analog |104| 71 | RB_PRESENT# | 1 | EC GPIO in (pull-up) | tied to GND on RB |  |105| 72–80 | GND | 9 | GND | GND | plus the connector's ground-pattern contacts — confirm pin numbering against the chosen ADM6/ADF6 variant |