Skip to content
RPRichard PruittTech & Cyber
Navigation
repo://poppyup/wiring/PU_Connection-Schedule_Rev-A.md

wiring/PU_Connection-Schedule_Rev-A.md

15 KB · 106 lines · markdown · View source · Download from the repository page

PoppyUp — connection schedule (Rev A, 2026-09-27, DRAFT — FOR REVIEW)

Generated from wiring/model.py. Off-board connections first (cables, flexes, mated modules, bonds), then on-board power links.

ID From To Medium Signal / service Class Length Status Source Sheets
W-01 Main board J3 Reader daughterboard J6 Direct mate, Samtec ADM6/ADF6 80-pin, stack 5–8 mm CFe B Gen3/Gen4 ×2 + REFCLK + sidebands; CFe A ×1; 3× Gen3 ×1 (GL9755/GL9750/ASM1064) + REFCLKs + PERST#; 3.3 V slots (8 pins) / 3.3 V logic (2) / 1.8 V (1); 5× PWR_EN; SLOT_FAULT#; SLOT_DET[4:0]; HALL; LED_DATA; I²C; NTC_CFEB; RB_PRESENT#; GND HS 0 (mated) Verified 09 §8.1 PU-W-101 PU-W-201
W-02 Battery pack PCB J1 Main board J12 6-way discrete-wire pack harness with locking connector PACK+, PACK−, SMBus CLK, SMBus DAT, NTC, PRES# POWER TBD (~60 mm est.) Verified 05 §2.5, 09 §9.1 PU-W-101 PU-W-202 PU-W-204
W-03 2.42" 128 × 64 OLED module, SSD1309, SPI FPC Main board J10 Module-supplied 30-pin 0.5 mm FPC OLED_SPI (SCLK, SDIN), OLED_CS, OLED_DC, OLED_RST, VDD 3.3 V, VCC 12 V (boost, on MB or in module — 05 §5), GND BUS module tail Verified 02 §8, 09 §9.1, 05 §5 PU-W-101 PU-W-204
W-04 Button flex (power/action button, ring light pipe) FPC Main board J11 6-pin 0.5 mm FPC (front-frame flex) BTN, button ring LED (if on flex), HALL (only if the Hall sensor is on the flex — conflict, see notes), 3.3 V AON, GND CTRL TBD Assumed 09 §9.1 (J11 'Button/Hall flex'), 09 §1 (Hall on RB), 09 §8.1 pin 66 PU-W-101 PU-W-204
W-05 M.2 Key-E 2230 Wi-Fi 7 module (MediaTek MT7925) ANT0 Wi-Fi antenna WIFI0, tri-band flex element PIG MHF4 (I-PEX 20449) 1.37 mm coax Wi-Fi chain 0, 2.4 / 5 / 6 GHz RF 140–150 mm (est.) Verified 07 §4.3 PU-W-101 PU-W-203
W-06 M.2 Key-E 2230 Wi-Fi 7 module (MediaTek MT7925) ANT1 Wi-Fi antenna WIFI1, tri-band flex element PIG MHF4 (I-PEX 20449) 1.37 mm coax Wi-Fi chain 1, 2.4 / 5 / 6 GHz RF ≈ 60 mm (est.) Verified 07 §4.3 PU-W-101 PU-W-203
W-07 Reader daughterboard J7 5-segment RGB LED bar — On-board LEDs (baseline) or 4-pin FPC to light-guide flex (alternative) LED_DATA (serial addressable), 3.3 V AON or 5 V (TBD, 05 §5 LDO note), GND CTRL — TBD 09 §9.2 J7, 09 §1, 05 §5 PU-W-101 PU-W-204
W-08 Mechanical thermal switch (hardware backstop) LEADS Main board TP-THSW 2 discrete leads, termination TBD THERM_ALERT to EC; contact in series with a circuit TBD (charge path / pack region, 06 §12 item 10) CTRL TBD TBD 00 §3.5, 02 §8, 06 §7.2/§12 PU-W-101 PU-W-103
W-09 Main board J17 Tunnel fan (reserved envelope, not fitted) — Reserved 3-pin 1.25 mm header, unpopulated Fan supply (rail TBD), GND, TACH/PWM (TBD) REF — TBD 09 §9.1, ADR D5 PU-W-101 PU-W-204
W-10 RK3588(J) SoM (Firefly Core-3588J default; Forlinx / board-down at PoC exit, D12) — Main board J1 Direct mate, SoM B2B connector set + 2× M2 retention screws pcie3x4 (Gen3 ×2 used), pcie3x2 (Gen3 ×2), pcie2x1l0/l1/l2, USB3 OTG0/OTG1, USB2 host ×2, SPI (TPM), UART/I²C/GPIO to EC, 5.0 V SYS in, GND MECH — Verified 02 §3, 09 §9.1, §11 PU-W-101
W-11 M.2 Key-E 2230 Wi-Fi 7 module (MediaTek MT7925) — Main board J8 Direct mate, M.2 Key-E socket + chassis-pressed standoff PCIe Gen2 ×1 (pcie2x1l1) + REFCLK + PERST#/CLKREQ#/W_DISABLE#, USB 2.0 (BT, held in reset), 3.3 V LOGIC via LC π filter, GND MECH — Verified 02 §4.4, 05 §5, 09 §11 PU-W-101 PU-W-203
W-12 M.2 M-key 2280 NVMe SSD (Pro SKU; socket empty on Base) — Main board J9 Direct mate, M.2 M-key socket + chassis-pressed standoff (Pro) PCIe Gen3 ×2 from ASM2812 + REFCLK + PERST#/CLKREQ#, 3.3 V via 2.5 A eFuse from 3.3 V SLOTS (or separate 3 A buck — EVT decision), GND MECH — Verified 02 §4.3, 05 §3.2/§4, 09 §11 PU-W-101 PU-W-203
W-13 Main board J4 Host / PD source on Port A (iPhone, Mac, PC, charger) — User cable, USB-C USB 3.2 Gen1 device (RK3588 OTG1) + USB 2.0; PD sink 5–20 V ≤ 100 W accepted (input limit 3.3 A at 20 V); PD source 5 V/1.5 A (PR_Swap option) HS — Verified 00 §3.3/3.4, 05 §7 PU-W-101 PU-W-203
W-14 Main board J5 External SSD / tethered phone / USB cellular adapter on Port B — User cable, USB-C USB 3.2 Gen2 host (ASM3142) + USB 2.0; 5 V source 0.5 / 1.5 / 3 A (Rp set by EC; 3 A only with external PD present, D13) HS — Verified 00 §3.3/3.4, 05 §7.4 PU-W-101 PU-W-203
W-15 Main board J6 USB4 host / PD source on Port C (Pro SKU) — User cable, USB-C (USB4 40 Gb/s rated) USB4 device (ASM2464PD, USB 3.2 Gen2 UAS fallback) — Pro only; PD sink 5–20 V ≤ 3.25 A via priority mux — Pro only; Base: receptacle blanked, VBUS to attach-detect only HS — Verified 00 §3.4, 05 §7.5 PU-W-101 PU-W-203
W-16 Main board J7 5GBASE-T network — Cat 6A patch cable 5GBASE-T, 4 MDI pairs through discrete magnetics; hinged door (IP54 closed) HS — Verified 00 §5, 09 §3.5, 08 §7 PU-W-101 PU-W-203
W-17 Main board GND Magnesium AZ91D chassis (ground reference) — 8× screw bosses on exposed L1 GND rings (6 vias each); masked bare conversion-coated Mg; Zn-Ni steel or Al screws Chassis ground bond BOND — Verified 09 §6, 08 §4.1 PU-W-101
W-18 Reader daughterboard GND Magnesium AZ91D chassis (ground reference) — RB mounting rail + 5 cage pins Chassis ground bond; shutter and connector cages grounded to RB GND BOND — Verified 09 §6, 08 §12 step 5 PU-W-101
W-19 Main board J4/J5/J6/J7 shells Magnesium AZ91D chassis (ground reference) — Receptacle brackets (Zn-Ni steel / Al) and RJ45 frame riveted to chassis wall Single-point-per-connector chassis bond; shells also to board GND at the connector BOND — Verified 09 §6, 08 §7 PU-W-101 PU-W-203
W-20 Battery pack PCB PACK− Main board GND One-point bond near the charger Battery negative reference BOND — Verified 09 §6 PU-W-101 PU-W-202
W-21 Wi-Fi antenna WIFI0, tri-band flex element shield Magnesium AZ91D chassis (ground reference) — Coax shield to chassis at the element end (feed PCB / EMI strip), within 10 mm of the element RF ground BOND — Verified 07 §4.3 PU-W-203

Notes per connection

  • W-01 — Logical allocation only; physical pin assignment finalised from connector S-parameters at layout (09 §8.1). Stack height set when 08 fixes RB-to-MB spacing (09 §13).
  • W-02 — Signal list from 05 §2.5. Connector family unresolved (see MB J12). Pack path rating: 10 A continuous / 20 A fuse (09 §2.3) vs 10 A chemical fuse, BQ40Z50 OCD 15 A (05 §2.5, §12) — reconcile. Battery negative bonded to MB GND at one point near the charger (09 §6).
  • W-03 — Pin numbers per the selected SSD1309 module datasheet — TBD. Connected at frame-marry step (08 §12 step 7).
  • W-04 — Hall sensor is listed both on RB (mezzanine pin 66 HALL) and on the J11 flex. Baseline drawn: Hall on RB; J11 carries button + ring LED. Pin allocation is a proposal.
  • W-05 — ≈ 140–150 mm along the chassis top rail; ≤ 0.35 dB at 6 GHz. Clipped every 30 mm; ≥ 10 mm from buck inductors; shield grounded to chassis within 10 mm of the element. ~30 mating cycles.
  • W-06 — ≈ 60 mm; ≤ 0.15 dB at 6 GHz. Same routing rules as W-05.
  • W-07 — Decide at industrial design. LED_DATA reaches RB over mezzanine pin 67. LED-bar supply: 3.3 V AON if peak ≤ 100 mA, else an LED driver from 5 V SYS (05 §5).
  • W-08 — Rating conflict: 48 °C (02 §8, 06 §7.2, 09 §7) vs '60 °C class, re-rated from 48 °C' (ADR 00 §3.5). Location and interrupted circuit fixed at EVT schematic release.
  • W-09 — Fan decision at the EVT-exit gate.
  • W-10 — J1/J2 do not exist if PoC exit selects board-down RK3588J (D12).
  • W-12 — Socket present on Base, module absent.
  • W-17 — Never stainless into Mg (D4). Contact resistance after 500 h salt fog — verify at EVT.
  • W-21 — Same for WIFI1.
ID From To Rail Current Status Source Notes
P-01 J4 Port A VBUS TPS25750-A (CC/PD) and VBUS priority mux input A (Pro) / 0 Ω bypass (Base) VBUS 5–20 V ≤ 3.25 A used (100 W tolerated) Verified 05 §7.1, 09 §5.1 TVS 24 V + OVP 22 V at the receptacle
P-02 J6 Port C VBUS TPS2121-class priority mux input B (Pro only) VBUS 5–20 V ≤ 3.25 A (verify mux at 20 V / 65 W) Verified 05 §7.5, 09 §5.1 Base: VBUS pin to attach-detect divider + TVS only
P-03 VBUS priority mux output BQ25792 VBUS input VBUS_IN 5–20 V ≤ 3.25 A Verified 09 §5.1 2× 22 µF + TVS at mux output; break-before-make gap ridden by charger input capacitance
P-04 J12 PACK+ / PACK− BQ25792 BAT VBAT 5.6–8.4 V (2S) 5 A charge; system path 7 A; pack fuse 10 A Verified 05 §2.5, §5, §8 Trace sized for 2× fuse rating to the fuse (05 §12)
P-05 BQ25792 VSYS 5.0 V SYS buck (TPS56637, 6 A) VSYS 6–8.4 V ≤ 3.1 A out Verified 05 §3.2, §5 Bulk on VSYS: 2× 470 µF polymer + 4× 22 µF (05 §10.2) vs 2× 220 µF + 10× 10 µF (09 §5.1) — reconcile
P-06 BQ25792 VSYS 5.0 V PORT B buck (TPS62933, 3 A) VSYS ≤ 3 A out Verified 05 §3.3, §5 EN from EC; enabled only on Port B attach
P-07 BQ25792 VSYS 3.3 V SLOTS buck (LMR33640, 4 A) VSYS ≤ 3.85 A out (6 A class on Pro if NVMe fed from it) Verified 05 §3.2, §5
P-08 BQ25792 VSYS 3.3 V LOGIC buck (LMR33640, 4 A) VSYS ≤ 3.1 A out (Pro peak) Verified 05 §3.2, §5 LC π filter at M.2 Key-E (< 20 mVpp)
P-09 VBAT (05 §4) / VSYS (09 §5.1) — conflict 3.3 V AON LDO (TPS7A16, 100–150 mA) VBAT or VSYS ≤ 120 mA Verified 05 §4, §5, 09 §5.1 05 feeds the AON LDO from VBAT (pack); 09 feeds it from VSYS. Drawn from VBAT (keeps EC alive with charger in ship mode); reconcile at schematic
P-10 3.3 V AON nRF5340 EC, Hall, RTC, SMBus pull-ups, LED bar (if ≤ 100 mA) 3.3 V AON ≤ 120 mA Verified 05 §3.2, §11 Coin cell MS621 (3 mAh) backs the RTC
P-11 5.0 V SYS SoM VIN via J1/J2 5.0 V ±3 % ≤ 1.6 A (8 W peak) Verified 05 §3.2 SoM's RK806 PMIC generates its own rails
P-12 5.0 V SYS Port A source eFuse 1.5 A → J4 VBUS (source role, PR_Swap phone top-up) 5.0 V 1.5 A Verified 05 §4, §7.2
P-13 5.0 V SYS OLED VCC boost 12 V (TPS61041 class, or in module) → J10 12 V ~30 mA Verified 05 §4, §5
P-14 5.0 V PORT B TPS2596 eFuse (3.3 A trip, EC ILIM 0.5/1.5/3 A) → J5 VBUS 5.0 V 0.5 / 1.5 / 3 A Verified 05 §7.4 Reverse-current blocking; VBUS applied only after Rp is set
P-15 3.3 V SLOTS J3 mezzanine pins 44–51 (8 pins) → RB slot eFuses 3.3 V ≥ 6 A total, 0.75 A/pin derated Verified 09 §8.1
P-16 3.3 V SLOTS eFuse 2.5 A (Pro) → J9 M.2 NVMe 3.3 V 3.3 V ≤ 1.8 A Verified 05 §3.2, §4 Alternative: separate 3 A buck — EVT decision
P-17 RB 3.3 V slots (post-mezzanine) 5× eFuse TPS2596 class → slots J1–J5 3.3 V CFe B 2.5 / CFe A 1.5 / CFast 1.0 / SD 0.8 / µSD 0.5 A (09 §5.2) vs 2.0 / 1.2 / 1.2 / 0.5 / 0.3 A (05 §3.2, §4) — conflict Verified 09 §5.2, 05 §3.2 EN = PWR_EN from EC AND card-detect; soft-start 1–2 ms; active discharge on CFe B; fault wired-OR to SLOT_FAULT#
P-18 3.3 V LOGIC ASM2812 I/O + 1.05 V local buck (TPS62823) 3.3 V / 1.05 V ~1 A core Verified 05 §4, 09 §5.1 Point-of-load buck ≤ 15 mm from the chip
P-19 3.3 V LOGIC RTL8126 I/O + 1.05 V local buck 3.3 V / 1.05 V ≤ 1.5 A core Verified 05 §4, 09 §5.1
P-20 3.3 V LOGIC ASM3142 + 1.05 V local buck 3.3 V / 1.05 V — Verified 05 §4, 09 §5.1
P-21 3.3 V LOGIC Load switch (ASM2464_PWR_EN from EC) → ASM2464PD + 1.05 V local buck + SPI flash (Pro) 3.3 V / 1.05 V ~1.2 A core Verified 05 §7.5, 09 §5.1, 02 §6.1 Bridge unpowered in standalone mode (zero draw)
P-22 3.3 V LOGIC J8 M.2 Key-E (MT7925) via LC π filter 3.3 V ≤ 0.75 A (2.5 W pk) Verified 05 §5
P-23 3.3 V LOGIC PI3DBS16412 lane mux, HCSL clock mux, 74LVC1G373 latch, TPM SLB9672 (1.8 V I/O per 09 §5.1), PD controllers ×3 3.3 V small Verified 05 §4, 09 §5.1, §5.4
P-24 3.3 V LOGIC J3 mezzanine pins 52–53 → RB GL9755 / GL9750 / ASM1064 (+ RB 1.2 V ASM1064 core) 3.3 V ~0.4 A Verified 09 §8.1, §2.2
P-25 1.8 V buck (1 A) on MB, fed from 3.3 V LOGIC (05 §3.2) UHS-II I/O (via mezzanine pin 54), TPM, misc I/O 1.8 V 0.6 A Verified 09 §5.1, §8.1 05 §5 lists a TLV75518 LDO for the readers' 1.8 V — one 1.8 V source, two documents; reconcile

Mezzanine J3/J6 allocation (PU-W-201, from docs/09 §8.1)

Pins Group n Main-board side Reader-board side Notes
1–8 CFe B PCIe lane 0/1 TX/RX (4 pairs) 8 PI3DBS16412 common port (Gen4-capable) J1 CFe B slot, L3 straight run ≤ 40 mm GND interleaved per Samtec ground pattern
9–10 CFe B REFCLK+/− 2 HCSL 2:1 clock mux output J1 CFe B REFCLK 100 Ω HCSL
11–13 CFe B PERST#, CLKREQ#, WAKE# 3 EC GPIO (PERST# out; CLKREQ#/WAKE# in) J1 CFe B sideband EC forwards to SoC or ASM2464PD by mode
14–17 CFe A PCIe lane 0 TX/RX (2 pairs) 4 ASM2812 downstream port (Gen3 ×1) J2 CFe A slot
18–19 CFe A REFCLK 2 ASM2812 downstream REFCLK J2 CFe A
20–22 CFe A PERST#, CLKREQ#, WAKE# 3 ASM2812 downstream / EC GPIO (owner TBD at schematic) J2 CFe A sideband
23–26 GL9755 lane (2 pairs) 4 ASM2812 downstream (Gen3 ×1) GL9755 (SD UHS-II host)
27–28 GL9755 REFCLK 2 ASM2812 GL9755
29 GL9755 PERST# 1 ASM2812 / EC (TBD) GL9755
30–33 GL9750 lane (2 pairs) 4 ASM2812 downstream (Gen3 ×1) GL9750 (microSD host)
34–35 GL9750 REFCLK 2 ASM2812 GL9750
36 GL9750 PERST# 1 ASM2812 / EC (TBD) GL9750
37–40 ASM1064 lane (2 pairs) 4 ASM2812 downstream (Gen3 ×1) ASM1064 (AHCI SATA → CFast)
41–42 ASM1064 REFCLK 2 ASM2812 ASM1064
43 ASM1064 PERST# 1 ASM2812 / EC (TBD) ASM1064
44–51 3.3 V SLOTS 8 3.3 V SLOTS buck output 5× slot eFuse inputs ≥ 6 A total, 0.75 A/pin derated
52–53 3.3 V LOGIC 2 3.3 V LOGIC buck GL9755 / GL9750 / ASM1064
54 1.8 V 1 1.8 V buck UHS-II I/O
55–59 CFEB / CFEA / SD / USD / CFAST_PWR_EN 5 EC GPIO out eFuse EN (AND card-detect)
60 SLOT_FAULT# 1 EC GPIO in wired-OR of 5 eFuse FLT#
61–65 SLOT_DET[4:0] 5 EC GPIO in (interrupt, wake) card-detect switches
66 HALL 1 EC GPIO in Hall sensor (shutter closed) see J11 conflict
67 LED_DATA 1 EC serial-LED out J7 LED bar
68–69 I²C SDA / SCL 2 EC I²C RB EEPROM (board ID / variant), eFuse telemetry
70 NTC_CFEB 1 EC ADC NTC at CFe B cage analog
71 RB_PRESENT# 1 EC GPIO in (pull-up) tied to GND on RB
72–80 GND 9 GND GND plus the connector's ground-pattern contacts — confirm pin numbering against the chosen ADM6/ADF6 variant