docs/10-bom.md
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# PoppyUp — Preliminary Bill of Materials **Phase 1 deliverable #10 — Baseline v0.3** (aligned to ADR v0.3, owner decisions D1–D13; v0.3 deltas: magnesium chassis + coating, Port C PD sink on Pro, Mg die-cast tool). Budgetary costs in USD, mid-2026, at 1 k and 10 k annual units. Part choices per `00-architecture-decisions.md` (ADR) and `04-component-selection.md`. Costs include PCBA and box-build labor but **exclude** tooling, NRE, certification, software, warranty reserve, freight, duties and packaging freight; those are broken out separately below. Confidence: ±15 % on silicon (quotes are distributor budgetary), ±25 % on mechanical (depends on the machined/thixomolded vs die-cast crossover and on magnesium casting and coating yield), ±30 % on assembly (depends on CM/ODM geography). The SoM alone is ~20 % of the Base BOM and is the single biggest cost lever; the SoM itself is undecided (D12) and the Firefly Core-3588J is carried here for costing until PoC exit. v0.2 removed the built-in cellular modem and its rail, antennas and SIM parts (~$146 @1k / ~$112 @10k in v0.1) per ADR §14, confirmed final in v0.3 (D1); cellular reach is via the user's phone or a USB LTE/5G adapter on Port B (ADR §4.3, §5). ## Summary | Group | Base @1k | Base @10k | Pro @1k | Pro @10k ||---|---:|---:|---:|---:|| Compute | $99 | $81 | $99 | $81 || PCIe fabric & bridges | $21 | $16 | $39 | $29 || Card slots & controllers | $18 | $14 | $18 | $14 || Networking | $10 | $8 | $10 | $8 || Wi-Fi/BLE | $18 | $12 | $18 | $12 || EC/UI | $18 | $13 | $18 | $13 || Security | $2 | $2 | $2 | $2 || Power | $68 | $52 | $72 | $55 || Connectors | $40 | $30 | $40 | $30 || PCBs | $41 | $22 | $41 | $22 || Mechanical | $93 | $42 | $155 | $94 || Assembly & test | $53 | $30 | $56 | $32 || Packaging & accessories | $8 | $6 | $8 | $6 || **Total** | **$488** | **$327** | **$575** | **$397** | **Comparison with the ADR §11 roll-up (v0.3):** ADR §11 targets Base ~$490 / ~$325 and Pro ~$575 / ~$400. The bottom-up lands at **$488 / $327 (Base)** and **$575 / $397 (Pro)** — within $3 of the ADR on every cell, inside the ±$5 band the ADR allows. Totals are summed from unrounded line items, so a column of rounded group subtotals can differ from the total by $1. The **v0.2 → v0.3 deltas** are: magnesium chassis-heatsink incl. conversion + powder coat **+$12.00 @1k / +$6.00 @10k, both SKUs** (D4); Port C PD sink — third TPS25750 **+$2.60 / +$2.00** and TPS2121-class VBUS priority mux **+$1.20 / +$0.90**, together **+$3.80 / +$2.90, Pro only** (D7, ADR says +$3–4, verify). Nothing else moved. v0.2 for reference: Base $476 / $321, Pro $559 / $389; v0.1 (ADR §11): Base ~$620/$430, Pro ~$705/$500 — the v0.1 → v0.2 delta was −$146 @1k / −$112 @10k for the Cellular section, +$1.20 / +$0.90 for the dedicated 5 V/3 A Port B buck, and −$0.70 / −$0.40 for the modem gap pad and SIM pin. **SKU logic:** Base and Pro share every PCB and the enclosure. Pro adds the ASM2464PD USB4 bridge path (~$18 populated), the **Port C PD sink** (third TPS25750 + TPS2121-class VBUS priority mux, ~$3.80 @1k, D7), a 1 TB NVMe (~$62 @1k) and ~$3 of extra test. Even the Port C USB-C receptacle is fitted on Base so that the enclosure and gasket tooling are identical (the port is blanked with a printed plug). **Base is independent of Port C (D7):** it is validated and shippable with the Port C footprints empty — the Base FCT fixture does not exercise Port C, Base regulatory testing covers the Base population, and the Pro USB4/PD-sink population is a later variant with its own 15B SDoC / RED addendum (`11-certification.md`), so Port C can slip to a later Pro revision without touching the Base cost or schedule. ## Line items ### Compute | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| SoM | Firefly Core-3588J, RK3588J, 8 GB LPDDR4x / 64 GB eMMC | 1 | $95.00 | $95.00 | $78.00 | $78.00 | both | industrial bin; **costing placeholder — SoM undecided (D12)**: PoC bake-off of Firefly (~$95), Forlinx FET3588-C (~$100) and board-down RK3588J on the ODM reference (~$60–70 silicon + board/NRE, verify); decide at PoC exit || SoM conn | Board-to-board connectors for SoM (set) | 1 | $2.50 | $2.50 | $1.80 | $1.80 | both | || RTC | RTC backup supercap / coin cell + holder | 1 | $1.20 | $1.20 | $0.90 | $0.90 | both | || | **Subtotal — Base** | | | **$99** | | **$81** | | | ### PCIe fabric & bridges | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| SW1 | ASMedia ASM2812 Gen3 packet switch | 1 | $12.00 | $12.00 | $9.00 | $9.00 | both | x2 up, 9 of 12 down used || MUX1 | Diodes PI3DBS16412 Gen4 x2 2:1 mux | 1 | $2.80 | $2.80 | $2.20 | $2.20 | both | CFe B slot to SoC / ASM2464PD || MUX2 | REFCLK 100 MHz mux + PCIe clock buffer | 1 | $1.50 | $1.50 | $1.10 | $1.10 | both | || BR1 | ASMedia ASM2464PD USB4 bridge + PD companion | 1 | $16.00 | $16.00 | $12.50 | $12.50 | pro | depopulated on Base || BR1 psv | ASM2464PD crystals, SPI flash, passives | 1 | $1.80 | $1.80 | $1.30 | $1.30 | pro | || XHCI | ASMedia ASM3142 USB 3.2 Gen2 host | 1 | $4.50 | $4.50 | $3.40 | $3.40 | both | Port B SSD ingest; also the host for USB-tethered phones and USB LTE/5G adapters (ADR §4.3) || | **Subtotal — Base** | | | **$21** | | **$16** | | || | **Subtotal — Pro** | | | **$39** | | **$29** | | | ### Card slots & controllers | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| SDC | Genesys GL9755 SD UHS-II controller | 1 | $3.80 | $3.80 | $3.00 | $3.00 | both | || uSDC | Genesys GL9750 microSD controller | 1 | $2.20 | $2.20 | $1.70 | $1.70 | both | || SATA | ASMedia ASM1064 AHCI (CFast) | 1 | $3.50 | $3.50 | $2.70 | $2.70 | both | || eFuse | TPS2596-class eFuse per slot | 5 | $0.90 | $4.50 | $0.70 | $3.50 | both | per-slot current limit || misc | Card-detect, ESD arrays, decoupling, LDOs for controllers | 1 | $4.00 | $4.00 | $3.00 | $3.00 | both | || | **Subtotal — Base** | | | **$18** | | **$14** | | | ### Networking | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| ETH | Realtek RTL8126 5GbE MAC/PHY | 1 | $5.00 | $5.00 | $3.90 | $3.90 | both | || RJ45 | 5GBASE-T-rated RJ45 + magnetics (discrete magnetics per `09-pcb-architecture.md` §3.5) | 1 | $3.50 | $3.50 | $2.70 | $2.70 | both | || ETH psv | Crystal, LEDs, chokes, ESD | 1 | $1.20 | $1.20 | $0.90 | $0.90 | both | || | **Subtotal — Base** | | | **$10** | | **$8** | | | ### Wi-Fi/BLE | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| WIFI | AzureWave AW-XB591NF (MT7925) M.2 E-key module | 1 | $11.00 | $11.00 | $8.50 | $8.50 | both | || M.2 E | M.2 Key-E 2230 socket + standoff | 1 | $0.90 | $0.90 | $0.70 | $0.70 | both | || ANT-W | Tri-band 2.4/5/6 GHz flex antenna | 2 | $2.00 | $4.00 | $0.90 | $1.80 | both | @10k LDS || RF cbl | MHF4 pigtail cables | 2 | $0.90 | $1.80 | $0.70 | $1.40 | both | || | **Subtotal — Base** | | | **$18** | | **$12** | | | ### EC/UI | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| EC | Nordic nRF5340 + crystals + chip antenna + matching | 1 | $7.50 | $7.50 | $6.00 | $6.00 | both | || OLED | 2.42" 128x64 SSD1309 OLED module | 1 | $5.00 | $5.00 | $3.80 | $3.80 | both | || LEDs | RGB LED bar (5 segments, addressable) + light guide | 1 | $1.80 | $1.80 | $1.30 | $1.30 | both | || BTN | Sealed tact switch + silicone actuator, reset switch | 1 | $1.20 | $1.20 | $0.90 | $0.90 | both | || HALL | Hall sensor (shutter), magnets 2x N52 | 1 | $1.00 | $1.00 | $0.70 | $0.70 | both | || TEMP | NTC/digital temperature sensors x4 | 1 | $1.00 | $1.00 | $0.70 | $0.70 | both | SoM edge, ASM2812, RTL8126, CFe B cage (pack NTC under PACK); one spare EC channel || | **Subtotal — Base** | | | **$18** | | **$13** | | | ### Security | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| TPM | Infineon OPTIGA SLB9672 TPM 2.0 | 1 | $2.40 | $2.40 | $1.90 | $1.90 | both | || | **Subtotal — Base** | | | **$2** | | **$2** | | | ### Power | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| CHG | TI BQ25792 buck-boost charger + inductor + FETs | 1 | $5.50 | $5.50 | $4.20 | $4.20 | both | || PD | TI TPS25750 PD controllers | 2 | $2.60 | $5.20 | $2.00 | $4.00 | both | Port A sink/source, Port B source || PD-C | TI TPS25750 PD controller, Port C sink role | 1 | $2.60 | $2.60 | $2.00 | $2.00 | pro | Port C PD sink (D7): Mac powers the device in reader mode; depopulated on Base with the ASM2464PD || MUX-C | TPS2121-class VBUS priority power mux (Port A priority, break-before-make, 5–20 V ≤ 3.25 A, verify at 65 W) + TVS | 1 | $1.20 | $1.20 | $0.90 | $0.90 | pro | ORs Port C VBUS with Port A VBUS into the BQ25792 input; Base fits a 0 Ω bypass || BUCK | 5 V/6 A, 3.3 V/4 A slot, 3.3 V/4 A logic, 1.8 V bucks (set) | 1 | $7.50 | $7.50 | $5.60 | $5.60 | both | v0.1 dedicated modem buck deleted (ADR §6) || BUCK-B | Dedicated 5.0 V/3 A Port B buck (TPS62933 class) + inductor + output caps; EC-programmable 0.5 / 1.5 / 3 A limit via the Port B eFuse | 1 | $1.20 | $1.20 | $0.90 | $0.90 | both | Tether/adapter supply kept off the SoM's 5 V SYS rail (ADR §6, `05-power-budget.md` §3.3); sits in the freed ex-modem area || LDO | Always-on 3.3 V LDO, local LDOs | 1 | $1.50 | $1.50 | $1.10 | $1.10 | both | || VBUS | USB VBUS eFuses / load switches | 3 | $0.80 | $2.40 | $0.60 | $1.80 | both | Ports A/B/C; the Port B eFuse carries the EC-set current limit fed from BUCK-B (1.5 A default, 3 A only with external PD present — EC policy, no part change, D13) || GAUGE | TI BQ40Z50-R2 gauge/protector | 1 | $4.20 | $4.20 | $3.30 | $3.30 | both | on pack PCB || PROT2 | BQ294xx secondary protector + FETs + fuse | 1 | $1.80 | $1.80 | $1.40 | $1.40 | both | || CELLS | Samsung INR21700-50E 21700 cell | 4 | $5.80 | $23.20 | $4.60 | $18.40 | both | UN 38.3 tested cells || PACK | Pack assembly: holder/frame, nickel strips, welding, wrap, connector, NTC | 1 | $11.00 | $11.00 | $7.50 | $7.50 | both | || psv | Bulk caps, inductors, sense resistors, TVS | 1 | $4.50 | $4.50 | $3.40 | $3.40 | both | || | **Subtotal — Base** | | | **$68** | | **$52** | | || | **Subtotal — Pro** | | | **$72** | | **$55** | | | ### Connectors | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| CFEB | Molex CFexpress Type B push-push | 1 | $6.00 | $6.00 | $4.50 | $4.50 | both | || CFEA | Molex CFexpress Type A push-push | 1 | $5.00 | $5.00 | $3.80 | $3.80 | both | || SD | SD UHS-II push-push | 1 | $2.50 | $2.50 | $1.90 | $1.90 | both | || uSD | microSD push-push | 1 | $0.80 | $0.80 | $0.60 | $0.60 | both | || CFAST | Amphenol CFast receptacle | 1 | $4.00 | $4.00 | $3.00 | $3.00 | both | || USBC | Amphenol IP67 mid-mount USB-C 24-pin | 3 | $2.40 | $7.20 | $1.80 | $5.40 | both | Port C receptacle fitted on Base for tooling commonality || M.2 M | M.2 M-key 2280 socket + standoff | 1 | $1.00 | $1.00 | $0.70 | $0.70 | both | empty on Base || MEZZ | Samtec ADM6/ADF6 80-pin pair | 1 | $9.00 | $9.00 | $6.50 | $6.50 | both | || FPC | OLED, LED bar, button/Hall FPC connectors + flexes | 1 | $3.50 | $3.50 | $2.50 | $2.50 | both | || PACK | Battery pack connector (main side) + harness | 1 | $1.50 | $1.50 | $1.10 | $1.10 | both | || | **Subtotal — Base** | | | **$40** | | **$30** | | | ### PCBs | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| MAIN | Main board 10L hybrid (Megtron 6 / I-Speed layers), ~165x80 mm | 1 | $28.00 | $28.00 | $15.00 | $15.00 | both | low-loss laminate for USB4/Gen4 || RDR | Reader daughterboard 8L, ~180x38 mm | 1 | $9.00 | $9.00 | $4.80 | $4.80 | both | || PACK | Battery pack PCB 2L | 1 | $1.50 | $1.50 | $0.80 | $0.80 | both | || FLEX | Flex circuits (OLED tail, button/Hall) | 1 | $2.50 | $2.50 | $1.50 | $1.50 | both | || | **Subtotal — Base** | | | **$41** | | **$22** | | | ### Mechanical | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| CHASSIS | Magnesium chassis-heatsink: machined AZ31B or thixomolded AZ91D @1k; AZ91D hot-chamber die-cast + boss machining @10k — both incl. chromate-free conversion coat + matte grey powder/e-coat with masked bare bosses (verify) | 1 | $58.00 | $58.00 | $21.00 | $21.00 | both | D4; +$12 @1k / +$6 @10k vs the v0.2 aluminum line ($46 / $15); tooling separate || FINISH | (note) Coating is carried inside the CHASSIS line: conversion coat ~$1.50 + powder/e-coat ~$4 @1k, ~$0.80 + ~$2.20 @10k (verify); PEO alternate would add ~$6 / ~$3 | — | — | — | — | — | both | shown for transparency, not a separate line || FRAME | PC+30% GF front frame with RF windows | 1 | $7.50 | $7.50 | $4.20 | $4.20 | both | || OVERMOLD | TPU Shore 80A overmold bumpers | 1 | $5.50 | $5.50 | $3.20 | $3.20 | both | || SHUTTER | 2.0 mm hard-anodized 6061 shutter plate | 1 | $6.00 | $6.00 | $3.20 | $3.20 | both | stamped + anodized @10k || RAILS | POM guide rails (2) + rear pocket | 1 | $2.50 | $2.50 | $1.40 | $1.40 | both | || DETENT | Stainless ball-spring detents, springs | 1 | $1.50 | $1.50 | $0.90 | $0.90 | both | || SEALS | Silicone lip seal, brush seals, port gaskets, RJ45 door, USB-C O-rings | 1 | $4.50 | $4.50 | $2.80 | $2.80 | both | || THERM | Thermal pads (SoM, switch, ETH, CFe cage), gap filler | 1 | $2.50 | $2.50 | $1.70 | $1.70 | both | modem pad removed (v0.2); thicker SoM/switch/PHY pads per D3 absorbed within the line (verify) || LENS | PC display lens with hardcoat + light guide | 1 | $1.80 | $1.80 | $1.10 | $1.10 | both | || HW | Screws, inserts, standoffs, EMI gaskets, labels | 1 | $3.00 | $3.00 | $2.00 | $2.00 | both | Zn-Ni-plated steel or Al screws, Al / Zn-Ni inserts (no stainless helicoils or brass in Mg, D4) || NVME | 1 TB M.2 2280 NVMe SSD + thermal pad | 1 | $62.00 | $62.00 | $52.00 | $52.00 | pro | Pro only || | **Subtotal — Base** | | | **$93** | | **$42** | | || | **Subtotal — Pro** | | | **$155** | | **$94** | | | ### Assembly & test | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| SMT | SMT main + reader + pack PCBA (incl. X-ray for BGA) | 1 | $26.00 | $26.00 | $15.00 | $15.00 | both | || BOX | Box build, pack integration, shutter/seal assembly | 1 | $14.00 | $14.00 | $8.00 | $8.00 | both | || FCT | Functional test, RF conducted test, seal leak test, calibration | 1 | $9.00 | $9.00 | $5.00 | $5.00 | both | Base fixture does not exercise Port C (D7); ODM typically owns the fixtures (D12) || BURN | Burn-in / soak (2 h), firmware load, provisioning | 1 | $4.00 | $4.00 | $2.50 | $2.50 | both | || PRO | Pro SKU extra: ASM2464PD firmware load + USB4 test, Port C PD-sink / mux hand-over test, NVMe test | 1 | $3.00 | $3.00 | $1.80 | $1.80 | pro | || | **Subtotal — Base** | | | **$53** | | **$30** | | || | **Subtotal — Pro** | | | **$56** | | **$32** | | | ### Packaging & accessories | Ref | Part | Qty | Unit @1k | Ext @1k | Unit @10k | Ext @10k | SKU | Notes ||---|---|---:|---:|---:|---:|---:|---|---|| CBL | USB-C to USB-C cable, 100 W, 1 m | 1 | $3.50 | $3.50 | $2.60 | $2.60 | both | || PKG | Retail box, inserts, quick-start card | 1 | $4.80 | $4.80 | $3.10 | $3.10 | both | SIM pin removed || | **Subtotal — Base** | | | **$8** | | **$6** | | | ## Tooling and NRE (one-time) | Item | Estimate | Notes ||---|---:|---|| Magnesium AZ91D hot-chamber die-cast tool, 2-cavity, heated runner, plus post-machining fixtures | $62 k | +12 % vs the v0.2 aluminum tool ($55 k), verify; not needed for EVT/DVT (machined AZ31B / thixomolded AZ91D); cut at DVT exit for PVT — ODM typically owns hard tooling from DVT exit (D12) || PC+GF front frame injection mold (steel, textured, with RF-window inserts) | $40 k | || TPU overmold tool (second shot over PC frame) | $28 k | || Shutter plate stamping die + anodize racks + POM rail molds | $18 k | CNC shutters for EVT/DVT || Silicone gasket / lip-seal compression molds, RJ45 door mold | $12 k | || OLED lens + light-guide tool | $6 k | || Battery pack holder mold, pack welding fixtures | $8 k | || Functional test fixtures (main, reader, pack), RF shield-box fixture (Wi-Fi/BLE), Port B tether emulator, leak tester | $22 k | Base fixture first; Pro adds Port C USB4 host + PD-source emulator (D7); ODM typically owns FCT/ICT fixtures (D12) || **Total tooling & fixtures** | **~$196 k** | Amortized over 10 k units ≈ $20/unit; ADR §11 rounds this to ~$195 k (v0.2: ~$189 k) || *Magnesium thixomold / soft tool for DVT thermal-validation units* | *~$35 k (verify)* | *Prototype tooling, not in the total above; carried in the DVT hardware budget (`13-roadmap.md` §8). Buys production-alloy AZ91D thermal data for the EVT-exit fan gate instead of correcting machined-AZ31B results (D4/D5)* | Non-recurring engineering that is not tooling (EVT/DVT PCB spins, SoM carrier NRE, antenna tuning, ASMedia design support, low-loss stack-up qualification) is estimated separately in `13-roadmap.md`; certification in `11-certification.md`. ## Cost-down levers | Lever | Saving per unit | Preconditions / cost ||---|---:|---|| Board-down RK3588J instead of SoM | $25–35 | Now one of the three PoC bake-off paths (D12, ADR §3.1) rather than a later lever: ~$120 k NRE (less with the ODM's reference design), LPDDR4x + eMMC + PMIC sourcing, 12-layer main board; also frees 20 % board area. If selected at PoC exit it becomes the baseline || LDS antennas on the PC frame (already assumed at 10 k) | $9–12 vs flex | $15 k LDS NRE, antenna tuning iteration at DVT || AZ91D die-cast chassis (already assumed at 10 k) | $37 vs machined AZ31B / thixomolded ($58 → $21) | $62 k tooling; Mg die-cast and coating yield learning curve || Drop CFast slot | $8–10 | Loses ASM1064, connector, 40 mm of board and enclosure (shorter device also saves ~$6 in chassis/frame); **closed — CFast kept (D3, ADR §13.3)**; listed for the record || Hirose FX23 mezzanine instead of Samtec ADM6/ADF6 | $3 | Verify shock performance at DVT || 2.5GbE (RTL8125BG) instead of 5GbE | $3 | Not recommended; spec regression || Single PD controller (TPS65988) for Ports A+B | $1.5 | Loses failure isolation || Standard laminate instead of hybrid low-loss on main board | $6–8 | Only viable if Port C (USB4) is dropped from all SKUs || Cellular accessory: recommend an off-the-shelf USB LTE/5G adapter (retail $60–150, its maker holds the certifications) | $0 BOM | Optional bundle; no PoppyUp hardware or certification impact (ADR §5, §14) | ## MSRP implications Hardware startups selling through a mix of direct and dealer channels need roughly 2.5–3.2× BOM to cover COGS overhead (freight, duty, yield, warranty ~8–10 %), dealer margin (25–35 %), and gross margin. | SKU | BOM @1k | BOM @10k | Implied MSRP range ||---|---:|---:|---|| Base | $488 | $327 | $1,200–1,550 at launch volumes; $800–1,050 at 10 k || Pro | $575 | $397 | $1,450–1,850 at launch; $1,000–1,250 at 10 k | **Target retail price and budget ceiling: not yet set by the owner; gap analysis deferred** until a target exists (ADR §11). The bands above are BOM-implied only. Reference points: a USB4 CFexpress 4.0 reader is $80–150; the user's phone or a $60–150 USB LTE/5G adapter replaces a built-in modem (a standalone 5G hotspot would be $300–500); a Gnarbox-class field backup device was $500–900; a broadcast bonded-cellular encoder is $3–8 k. PoppyUp lands in the "pro accessory" tier and its price will be judged against renting a DIT with a laptop, not against consumer readers. ## Largest cost risks 1. **SoM price and continuity** — a single-vendor SoM at $95; a pin-incompatible alternate costs a carrier respin. Mitigation: the PoC bake-off (D12) evaluates Firefly, Forlinx and ODM board-down side by side with longevity terms in writing as a criterion, so the decision is made before EVT rather than as a DVT re-qualification.2. **Low-loss PCB** — the hybrid 10-layer main board at $28 assumes Megtron 6 / I-Speed on two signal layers only; if SI results force full low-loss build, add $10–14/board.3. **Enclosure yield** — die-cast + boss machining + conversion coat + powder/e-coat + overmold is five processes with cosmetic acceptance criteria; a 10 % scrap rate adds ~$4–5/unit; cosmetic standards must be set at DVT.4. **Cells** — 21700 cell pricing is stable but allocation swings; three-vendor qualification (Samsung/LG/Molicel) is a schedule item, not just a BOM line.5. **Tariffs and duty** — not included; PoppyUp is no longer a cellular terminal, and its classification as a non-cellular network storage/reader device is to be confirmed (HTS 8471.70 or 8517.62 both remain plausible for a Wi-Fi device; duty 0–25 % depending on origin and heading); decide CM geography early.6. **NVMe (Pro)** — commodity, but industrial-grade 1 TB with a 5-year controller life carries a ~30 % premium over consumer parts; decide grade at DVT.7. **Magnesium die-cast supplier and coating yield** — hot-chamber Mg casting and chromate-free conversion + powder/e-coat with masked bosses is a narrower supplier base than aluminum; porosity at the 1.6 mm walls, masking rework and coating adhesion failures each hit yield, and the +$6 @10k premium (verify) assumes a laptop-chassis-class supplier. The ODM design-review package asks for Mg die-cast and coating supplier candidates (D12); coupon salt-fog and adhesion tests run at EVT. Thixomold (~$35 k) is the schedule hedge for DVT.