PoppyUp — Preliminary Bill of Materials
Phase 1 deliverable #10 — Baseline v0.3 (aligned to ADR v0.3, owner decisions D1–D13; v0.3 deltas: magnesium chassis + coating, Port C PD sink on Pro, Mg die-cast tool). Budgetary costs in USD, mid-2026, at 1 k and 10 k annual units. Part choices per 00-architecture-decisions.md (ADR) and 04-component-selection.md. Costs include PCBA and box-build labor but exclude tooling, NRE, certification, software, warranty reserve, freight, duties and packaging freight; those are broken out separately below.
Confidence: ±15 % on silicon (quotes are distributor budgetary), ±25 % on mechanical (depends on the machined/thixomolded vs die-cast crossover and on magnesium casting and coating yield), ±30 % on assembly (depends on CM/ODM geography). The SoM alone is 20 % of the Base BOM and is the single biggest cost lever; the SoM itself is undecided (D12) and the Firefly Core-3588J is carried here for costing until PoC exit. v0.2 removed the built-in cellular modem and its rail, antennas and SIM parts ($146 @1k / ~$112 @10k in v0.1) per ADR §14, confirmed final in v0.3 (D1); cellular reach is via the user's phone or a USB LTE/5G adapter on Port B (ADR §4.3, §5).
Summary
| Group |
Base @1k |
Base @10k |
Pro @1k |
Pro @10k |
| Compute |
$99 |
$81 |
$99 |
$81 |
| PCIe fabric & bridges |
$21 |
$16 |
$39 |
$29 |
| Card slots & controllers |
$18 |
$14 |
$18 |
$14 |
| Networking |
$10 |
$8 |
$10 |
$8 |
| Wi-Fi/BLE |
$18 |
$12 |
$18 |
$12 |
| EC/UI |
$18 |
$13 |
$18 |
$13 |
| Security |
$2 |
$2 |
$2 |
$2 |
| Power |
$68 |
$52 |
$72 |
$55 |
| Connectors |
$40 |
$30 |
$40 |
$30 |
| PCBs |
$41 |
$22 |
$41 |
$22 |
| Mechanical |
$93 |
$42 |
$155 |
$94 |
| Assembly & test |
$53 |
$30 |
$56 |
$32 |
| Packaging & accessories |
$8 |
$6 |
$8 |
$6 |
| Total |
$488 |
$327 |
$575 |
$397 |
Comparison with the ADR §11 roll-up (v0.3): ADR §11 targets Base ~$490 / ~$325 and Pro ~$575 / ~$400. The bottom-up lands at $488 / $327 (Base) and $575 / $397 (Pro) — within $3 of the ADR on every cell, inside the ±$5 band the ADR allows. Totals are summed from unrounded line items, so a column of rounded group subtotals can differ from the total by $1. The v0.2 → v0.3 deltas are: magnesium chassis-heatsink incl. conversion + powder coat +$12.00 @1k / +$6.00 @10k, both SKUs (D4); Port C PD sink — third TPS25750 +$2.60 / +$2.00 and TPS2121-class VBUS priority mux +$1.20 / +$0.90, together +$3.80 / +$2.90, Pro only (D7, ADR says +$3–4, verify). Nothing else moved. v0.2 for reference: Base $476 / $321, Pro $559 / $389; v0.1 (ADR §11): Base ~$620/$430, Pro ~$705/$500 — the v0.1 → v0.2 delta was −$146 @1k / −$112 @10k for the Cellular section, +$1.20 / +$0.90 for the dedicated 5 V/3 A Port B buck, and −$0.70 / −$0.40 for the modem gap pad and SIM pin.
SKU logic: Base and Pro share every PCB and the enclosure. Pro adds the ASM2464PD USB4 bridge path (~$18 populated), the Port C PD sink (third TPS25750 + TPS2121-class VBUS priority mux, $3.80 @1k, D7), a 1 TB NVMe ($62 @1k) and ~$3 of extra test. Even the Port C USB-C receptacle is fitted on Base so that the enclosure and gasket tooling are identical (the port is blanked with a printed plug). Base is independent of Port C (D7): it is validated and shippable with the Port C footprints empty — the Base FCT fixture does not exercise Port C, Base regulatory testing covers the Base population, and the Pro USB4/PD-sink population is a later variant with its own 15B SDoC / RED addendum (11-certification.md), so Port C can slip to a later Pro revision without touching the Base cost or schedule.
Line items
Compute
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| SoM |
Firefly Core-3588J, RK3588J, 8 GB LPDDR4x / 64 GB eMMC |
1 |
$95.00 |
$95.00 |
$78.00 |
$78.00 |
both |
industrial bin; costing placeholder — SoM undecided (D12): PoC bake-off of Firefly ($95), Forlinx FET3588-C ($100) and board-down RK3588J on the ODM reference (~$60–70 silicon + board/NRE, verify); decide at PoC exit |
| SoM conn |
Board-to-board connectors for SoM (set) |
1 |
$2.50 |
$2.50 |
$1.80 |
$1.80 |
both |
|
| RTC |
RTC backup supercap / coin cell + holder |
1 |
$1.20 |
$1.20 |
$0.90 |
$0.90 |
both |
|
|
Subtotal — Base |
|
|
$99 |
|
$81 |
|
|
PCIe fabric & bridges
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| SW1 |
ASMedia ASM2812 Gen3 packet switch |
1 |
$12.00 |
$12.00 |
$9.00 |
$9.00 |
both |
x2 up, 9 of 12 down used |
| MUX1 |
Diodes PI3DBS16412 Gen4 x2 2:1 mux |
1 |
$2.80 |
$2.80 |
$2.20 |
$2.20 |
both |
CFe B slot to SoC / ASM2464PD |
| MUX2 |
REFCLK 100 MHz mux + PCIe clock buffer |
1 |
$1.50 |
$1.50 |
$1.10 |
$1.10 |
both |
|
| BR1 |
ASMedia ASM2464PD USB4 bridge + PD companion |
1 |
$16.00 |
$16.00 |
$12.50 |
$12.50 |
pro |
depopulated on Base |
| BR1 psv |
ASM2464PD crystals, SPI flash, passives |
1 |
$1.80 |
$1.80 |
$1.30 |
$1.30 |
pro |
|
| XHCI |
ASMedia ASM3142 USB 3.2 Gen2 host |
1 |
$4.50 |
$4.50 |
$3.40 |
$3.40 |
both |
Port B SSD ingest; also the host for USB-tethered phones and USB LTE/5G adapters (ADR §4.3) |
|
Subtotal — Base |
|
|
$21 |
|
$16 |
|
|
|
Subtotal — Pro |
|
|
$39 |
|
$29 |
|
|
Card slots & controllers
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| SDC |
Genesys GL9755 SD UHS-II controller |
1 |
$3.80 |
$3.80 |
$3.00 |
$3.00 |
both |
|
| uSDC |
Genesys GL9750 microSD controller |
1 |
$2.20 |
$2.20 |
$1.70 |
$1.70 |
both |
|
| SATA |
ASMedia ASM1064 AHCI (CFast) |
1 |
$3.50 |
$3.50 |
$2.70 |
$2.70 |
both |
|
| eFuse |
TPS2596-class eFuse per slot |
5 |
$0.90 |
$4.50 |
$0.70 |
$3.50 |
both |
per-slot current limit |
| misc |
Card-detect, ESD arrays, decoupling, LDOs for controllers |
1 |
$4.00 |
$4.00 |
$3.00 |
$3.00 |
both |
|
|
Subtotal — Base |
|
|
$18 |
|
$14 |
|
|
Networking
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| ETH |
Realtek RTL8126 5GbE MAC/PHY |
1 |
$5.00 |
$5.00 |
$3.90 |
$3.90 |
both |
|
| RJ45 |
5GBASE-T-rated RJ45 + magnetics (discrete magnetics per 09-pcb-architecture.md §3.5) |
1 |
$3.50 |
$3.50 |
$2.70 |
$2.70 |
both |
|
| ETH psv |
Crystal, LEDs, chokes, ESD |
1 |
$1.20 |
$1.20 |
$0.90 |
$0.90 |
both |
|
|
Subtotal — Base |
|
|
$10 |
|
$8 |
|
|
Wi-Fi/BLE
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| WIFI |
AzureWave AW-XB591NF (MT7925) M.2 E-key module |
1 |
$11.00 |
$11.00 |
$8.50 |
$8.50 |
both |
|
| M.2 E |
M.2 Key-E 2230 socket + standoff |
1 |
$0.90 |
$0.90 |
$0.70 |
$0.70 |
both |
|
| ANT-W |
Tri-band 2.4/5/6 GHz flex antenna |
2 |
$2.00 |
$4.00 |
$0.90 |
$1.80 |
both |
@10k LDS |
| RF cbl |
MHF4 pigtail cables |
2 |
$0.90 |
$1.80 |
$0.70 |
$1.40 |
both |
|
|
Subtotal — Base |
|
|
$18 |
|
$12 |
|
|
EC/UI
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| EC |
Nordic nRF5340 + crystals + chip antenna + matching |
1 |
$7.50 |
$7.50 |
$6.00 |
$6.00 |
both |
|
| OLED |
2.42" 128x64 SSD1309 OLED module |
1 |
$5.00 |
$5.00 |
$3.80 |
$3.80 |
both |
|
| LEDs |
RGB LED bar (5 segments, addressable) + light guide |
1 |
$1.80 |
$1.80 |
$1.30 |
$1.30 |
both |
|
| BTN |
Sealed tact switch + silicone actuator, reset switch |
1 |
$1.20 |
$1.20 |
$0.90 |
$0.90 |
both |
|
| HALL |
Hall sensor (shutter), magnets 2x N52 |
1 |
$1.00 |
$1.00 |
$0.70 |
$0.70 |
both |
|
| TEMP |
NTC/digital temperature sensors x4 |
1 |
$1.00 |
$1.00 |
$0.70 |
$0.70 |
both |
SoM edge, ASM2812, RTL8126, CFe B cage (pack NTC under PACK); one spare EC channel |
|
Subtotal — Base |
|
|
$18 |
|
$13 |
|
|
Security
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| TPM |
Infineon OPTIGA SLB9672 TPM 2.0 |
1 |
$2.40 |
$2.40 |
$1.90 |
$1.90 |
both |
|
|
Subtotal — Base |
|
|
$2 |
|
$2 |
|
|
Power
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| CHG |
TI BQ25792 buck-boost charger + inductor + FETs |
1 |
$5.50 |
$5.50 |
$4.20 |
$4.20 |
both |
|
| PD |
TI TPS25750 PD controllers |
2 |
$2.60 |
$5.20 |
$2.00 |
$4.00 |
both |
Port A sink/source, Port B source |
| PD-C |
TI TPS25750 PD controller, Port C sink role |
1 |
$2.60 |
$2.60 |
$2.00 |
$2.00 |
pro |
Port C PD sink (D7): Mac powers the device in reader mode; depopulated on Base with the ASM2464PD |
| MUX-C |
TPS2121-class VBUS priority power mux (Port A priority, break-before-make, 5–20 V ≤ 3.25 A, verify at 65 W) + TVS |
1 |
$1.20 |
$1.20 |
$0.90 |
$0.90 |
pro |
ORs Port C VBUS with Port A VBUS into the BQ25792 input; Base fits a 0 Ω bypass |
| BUCK |
5 V/6 A, 3.3 V/4 A slot, 3.3 V/4 A logic, 1.8 V bucks (set) |
1 |
$7.50 |
$7.50 |
$5.60 |
$5.60 |
both |
v0.1 dedicated modem buck deleted (ADR §6) |
| BUCK-B |
Dedicated 5.0 V/3 A Port B buck (TPS62933 class) + inductor + output caps; EC-programmable 0.5 / 1.5 / 3 A limit via the Port B eFuse |
1 |
$1.20 |
$1.20 |
$0.90 |
$0.90 |
both |
Tether/adapter supply kept off the SoM's 5 V SYS rail (ADR §6, 05-power-budget.md §3.3); sits in the freed ex-modem area |
| LDO |
Always-on 3.3 V LDO, local LDOs |
1 |
$1.50 |
$1.50 |
$1.10 |
$1.10 |
both |
|
| VBUS |
USB VBUS eFuses / load switches |
3 |
$0.80 |
$2.40 |
$0.60 |
$1.80 |
both |
Ports A/B/C; the Port B eFuse carries the EC-set current limit fed from BUCK-B (1.5 A default, 3 A only with external PD present — EC policy, no part change, D13) |
| GAUGE |
TI BQ40Z50-R2 gauge/protector |
1 |
$4.20 |
$4.20 |
$3.30 |
$3.30 |
both |
on pack PCB |
| PROT2 |
BQ294xx secondary protector + FETs + fuse |
1 |
$1.80 |
$1.80 |
$1.40 |
$1.40 |
both |
|
| CELLS |
Samsung INR21700-50E 21700 cell |
4 |
$5.80 |
$23.20 |
$4.60 |
$18.40 |
both |
UN 38.3 tested cells |
| PACK |
Pack assembly: holder/frame, nickel strips, welding, wrap, connector, NTC |
1 |
$11.00 |
$11.00 |
$7.50 |
$7.50 |
both |
|
| psv |
Bulk caps, inductors, sense resistors, TVS |
1 |
$4.50 |
$4.50 |
$3.40 |
$3.40 |
both |
|
|
Subtotal — Base |
|
|
$68 |
|
$52 |
|
|
|
Subtotal — Pro |
|
|
$72 |
|
$55 |
|
|
Connectors
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| CFEB |
Molex CFexpress Type B push-push |
1 |
$6.00 |
$6.00 |
$4.50 |
$4.50 |
both |
|
| CFEA |
Molex CFexpress Type A push-push |
1 |
$5.00 |
$5.00 |
$3.80 |
$3.80 |
both |
|
| SD |
SD UHS-II push-push |
1 |
$2.50 |
$2.50 |
$1.90 |
$1.90 |
both |
|
| uSD |
microSD push-push |
1 |
$0.80 |
$0.80 |
$0.60 |
$0.60 |
both |
|
| CFAST |
Amphenol CFast receptacle |
1 |
$4.00 |
$4.00 |
$3.00 |
$3.00 |
both |
|
| USBC |
Amphenol IP67 mid-mount USB-C 24-pin |
3 |
$2.40 |
$7.20 |
$1.80 |
$5.40 |
both |
Port C receptacle fitted on Base for tooling commonality |
| M.2 M |
M.2 M-key 2280 socket + standoff |
1 |
$1.00 |
$1.00 |
$0.70 |
$0.70 |
both |
empty on Base |
| MEZZ |
Samtec ADM6/ADF6 80-pin pair |
1 |
$9.00 |
$9.00 |
$6.50 |
$6.50 |
both |
|
| FPC |
OLED, LED bar, button/Hall FPC connectors + flexes |
1 |
$3.50 |
$3.50 |
$2.50 |
$2.50 |
both |
|
| PACK |
Battery pack connector (main side) + harness |
1 |
$1.50 |
$1.50 |
$1.10 |
$1.10 |
both |
|
|
Subtotal — Base |
|
|
$40 |
|
$30 |
|
|
PCBs
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| MAIN |
Main board 10L hybrid (Megtron 6 / I-Speed layers), ~165x80 mm |
1 |
$28.00 |
$28.00 |
$15.00 |
$15.00 |
both |
low-loss laminate for USB4/Gen4 |
| RDR |
Reader daughterboard 8L, ~180x38 mm |
1 |
$9.00 |
$9.00 |
$4.80 |
$4.80 |
both |
|
| PACK |
Battery pack PCB 2L |
1 |
$1.50 |
$1.50 |
$0.80 |
$0.80 |
both |
|
| FLEX |
Flex circuits (OLED tail, button/Hall) |
1 |
$2.50 |
$2.50 |
$1.50 |
$1.50 |
both |
|
|
Subtotal — Base |
|
|
$41 |
|
$22 |
|
|
Mechanical
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| CHASSIS |
Magnesium chassis-heatsink: machined AZ31B or thixomolded AZ91D @1k; AZ91D hot-chamber die-cast + boss machining @10k — both incl. chromate-free conversion coat + matte grey powder/e-coat with masked bare bosses (verify) |
1 |
$58.00 |
$58.00 |
$21.00 |
$21.00 |
both |
D4; +$12 @1k / +$6 @10k vs the v0.2 aluminum line ($46 / $15); tooling separate |
| FINISH |
(note) Coating is carried inside the CHASSIS line: conversion coat ~$1.50 + powder/e-coat ~$4 @1k, ~$0.80 + ~$2.20 @10k (verify); PEO alternate would add ~$6 / ~$3 |
— |
— |
— |
— |
— |
both |
shown for transparency, not a separate line |
| FRAME |
PC+30% GF front frame with RF windows |
1 |
$7.50 |
$7.50 |
$4.20 |
$4.20 |
both |
|
| OVERMOLD |
TPU Shore 80A overmold bumpers |
1 |
$5.50 |
$5.50 |
$3.20 |
$3.20 |
both |
|
| SHUTTER |
2.0 mm hard-anodized 6061 shutter plate |
1 |
$6.00 |
$6.00 |
$3.20 |
$3.20 |
both |
stamped + anodized @10k |
| RAILS |
POM guide rails (2) + rear pocket |
1 |
$2.50 |
$2.50 |
$1.40 |
$1.40 |
both |
|
| DETENT |
Stainless ball-spring detents, springs |
1 |
$1.50 |
$1.50 |
$0.90 |
$0.90 |
both |
|
| SEALS |
Silicone lip seal, brush seals, port gaskets, RJ45 door, USB-C O-rings |
1 |
$4.50 |
$4.50 |
$2.80 |
$2.80 |
both |
|
| THERM |
Thermal pads (SoM, switch, ETH, CFe cage), gap filler |
1 |
$2.50 |
$2.50 |
$1.70 |
$1.70 |
both |
modem pad removed (v0.2); thicker SoM/switch/PHY pads per D3 absorbed within the line (verify) |
| LENS |
PC display lens with hardcoat + light guide |
1 |
$1.80 |
$1.80 |
$1.10 |
$1.10 |
both |
|
| HW |
Screws, inserts, standoffs, EMI gaskets, labels |
1 |
$3.00 |
$3.00 |
$2.00 |
$2.00 |
both |
Zn-Ni-plated steel or Al screws, Al / Zn-Ni inserts (no stainless helicoils or brass in Mg, D4) |
| NVME |
1 TB M.2 2280 NVMe SSD + thermal pad |
1 |
$62.00 |
$62.00 |
$52.00 |
$52.00 |
pro |
Pro only |
|
Subtotal — Base |
|
|
$93 |
|
$42 |
|
|
|
Subtotal — Pro |
|
|
$155 |
|
$94 |
|
|
Assembly & test
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| SMT |
SMT main + reader + pack PCBA (incl. X-ray for BGA) |
1 |
$26.00 |
$26.00 |
$15.00 |
$15.00 |
both |
|
| BOX |
Box build, pack integration, shutter/seal assembly |
1 |
$14.00 |
$14.00 |
$8.00 |
$8.00 |
both |
|
| FCT |
Functional test, RF conducted test, seal leak test, calibration |
1 |
$9.00 |
$9.00 |
$5.00 |
$5.00 |
both |
Base fixture does not exercise Port C (D7); ODM typically owns the fixtures (D12) |
| BURN |
Burn-in / soak (2 h), firmware load, provisioning |
1 |
$4.00 |
$4.00 |
$2.50 |
$2.50 |
both |
|
| PRO |
Pro SKU extra: ASM2464PD firmware load + USB4 test, Port C PD-sink / mux hand-over test, NVMe test |
1 |
$3.00 |
$3.00 |
$1.80 |
$1.80 |
pro |
|
|
Subtotal — Base |
|
|
$53 |
|
$30 |
|
|
|
Subtotal — Pro |
|
|
$56 |
|
$32 |
|
|
Packaging & accessories
| Ref |
Part |
Qty |
Unit @1k |
Ext @1k |
Unit @10k |
Ext @10k |
SKU |
Notes |
| CBL |
USB-C to USB-C cable, 100 W, 1 m |
1 |
$3.50 |
$3.50 |
$2.60 |
$2.60 |
both |
|
| PKG |
Retail box, inserts, quick-start card |
1 |
$4.80 |
$4.80 |
$3.10 |
$3.10 |
both |
SIM pin removed |
|
Subtotal — Base |
|
|
$8 |
|
$6 |
|
|
| Item |
Estimate |
Notes |
| Magnesium AZ91D hot-chamber die-cast tool, 2-cavity, heated runner, plus post-machining fixtures |
$62 k |
+12 % vs the v0.2 aluminum tool ($55 k), verify; not needed for EVT/DVT (machined AZ31B / thixomolded AZ91D); cut at DVT exit for PVT — ODM typically owns hard tooling from DVT exit (D12) |
| PC+GF front frame injection mold (steel, textured, with RF-window inserts) |
$40 k |
|
| TPU overmold tool (second shot over PC frame) |
$28 k |
|
| Shutter plate stamping die + anodize racks + POM rail molds |
$18 k |
CNC shutters for EVT/DVT |
| Silicone gasket / lip-seal compression molds, RJ45 door mold |
$12 k |
|
| OLED lens + light-guide tool |
$6 k |
|
| Battery pack holder mold, pack welding fixtures |
$8 k |
|
| Functional test fixtures (main, reader, pack), RF shield-box fixture (Wi-Fi/BLE), Port B tether emulator, leak tester |
$22 k |
Base fixture first; Pro adds Port C USB4 host + PD-source emulator (D7); ODM typically owns FCT/ICT fixtures (D12) |
| Total tooling & fixtures |
~$196 k |
Amortized over 10 k units ≈ $20/unit; ADR §11 rounds this to ~$195 k (v0.2: ~$189 k) |
| Magnesium thixomold / soft tool for DVT thermal-validation units |
~$35 k (verify) |
Prototype tooling, not in the total above; carried in the DVT hardware budget (13-roadmap.md §8). Buys production-alloy AZ91D thermal data for the EVT-exit fan gate instead of correcting machined-AZ31B results (D4/D5) |
Non-recurring engineering that is not tooling (EVT/DVT PCB spins, SoM carrier NRE, antenna tuning, ASMedia design support, low-loss stack-up qualification) is estimated separately in 13-roadmap.md; certification in 11-certification.md.
Cost-down levers
| Lever |
Saving per unit |
Preconditions / cost |
| Board-down RK3588J instead of SoM |
$25–35 |
Now one of the three PoC bake-off paths (D12, ADR §3.1) rather than a later lever: ~$120 k NRE (less with the ODM's reference design), LPDDR4x + eMMC + PMIC sourcing, 12-layer main board; also frees 20 % board area. If selected at PoC exit it becomes the baseline |
| LDS antennas on the PC frame (already assumed at 10 k) |
$9–12 vs flex |
$15 k LDS NRE, antenna tuning iteration at DVT |
| AZ91D die-cast chassis (already assumed at 10 k) |
$37 vs machined AZ31B / thixomolded ($58 → $21) |
$62 k tooling; Mg die-cast and coating yield learning curve |
| Drop CFast slot |
$8–10 |
Loses ASM1064, connector, 40 mm of board and enclosure (shorter device also saves ~$6 in chassis/frame); closed — CFast kept (D3, ADR §13.3); listed for the record |
| Hirose FX23 mezzanine instead of Samtec ADM6/ADF6 |
$3 |
Verify shock performance at DVT |
| 2.5GbE (RTL8125BG) instead of 5GbE |
$3 |
Not recommended; spec regression |
| Single PD controller (TPS65988) for Ports A+B |
$1.5 |
Loses failure isolation |
| Standard laminate instead of hybrid low-loss on main board |
$6–8 |
Only viable if Port C (USB4) is dropped from all SKUs |
| Cellular accessory: recommend an off-the-shelf USB LTE/5G adapter (retail $60–150, its maker holds the certifications) |
$0 BOM |
Optional bundle; no PoppyUp hardware or certification impact (ADR §5, §14) |
MSRP implications
Hardware startups selling through a mix of direct and dealer channels need roughly 2.5–3.2× BOM to cover COGS overhead (freight, duty, yield, warranty ~8–10 %), dealer margin (25–35 %), and gross margin.
| SKU |
BOM @1k |
BOM @10k |
Implied MSRP range |
| Base |
$488 |
$327 |
$1,200–1,550 at launch volumes; $800–1,050 at 10 k |
| Pro |
$575 |
$397 |
$1,450–1,850 at launch; $1,000–1,250 at 10 k |
Target retail price and budget ceiling: not yet set by the owner; gap analysis deferred until a target exists (ADR §11). The bands above are BOM-implied only.
Reference points: a USB4 CFexpress 4.0 reader is $80–150; the user's phone or a $60–150 USB LTE/5G adapter replaces a built-in modem (a standalone 5G hotspot would be $300–500); a Gnarbox-class field backup device was $500–900; a broadcast bonded-cellular encoder is $3–8 k. PoppyUp lands in the "pro accessory" tier and its price will be judged against renting a DIT with a laptop, not against consumer readers.
Largest cost risks
- SoM price and continuity — a single-vendor SoM at $95; a pin-incompatible alternate costs a carrier respin. Mitigation: the PoC bake-off (D12) evaluates Firefly, Forlinx and ODM board-down side by side with longevity terms in writing as a criterion, so the decision is made before EVT rather than as a DVT re-qualification.
- Low-loss PCB — the hybrid 10-layer main board at $28 assumes Megtron 6 / I-Speed on two signal layers only; if SI results force full low-loss build, add $10–14/board.
- Enclosure yield — die-cast + boss machining + conversion coat + powder/e-coat + overmold is five processes with cosmetic acceptance criteria; a 10 % scrap rate adds ~$4–5/unit; cosmetic standards must be set at DVT.
- Cells — 21700 cell pricing is stable but allocation swings; three-vendor qualification (Samsung/LG/Molicel) is a schedule item, not just a BOM line.
- Tariffs and duty — not included; PoppyUp is no longer a cellular terminal, and its classification as a non-cellular network storage/reader device is to be confirmed (HTS 8471.70 or 8517.62 both remain plausible for a Wi-Fi device; duty 0–25 % depending on origin and heading); decide CM geography early.
- NVMe (Pro) — commodity, but industrial-grade 1 TB with a 5-year controller life carries a ~30 % premium over consumer parts; decide grade at DVT.
- Magnesium die-cast supplier and coating yield — hot-chamber Mg casting and chromate-free conversion + powder/e-coat with masked bosses is a narrower supplier base than aluminum; porosity at the 1.6 mm walls, masking rework and coating adhesion failures each hit yield, and the +$6 @10k premium (verify) assumes a laptop-chassis-class supplier. The ODM design-review package asks for Mg die-cast and coating supplier candidates (D12); coupon salt-fog and adhesion tests run at EVT. Thixomold (~$35 k) is the schedule hedge for DVT.